Glass substrates for high-performance RF and HPC use cases. 2D and 3D stacking.
High performance AI for Data Center and Edge.
Light replaces wires in connecting chiplets, chips, and/or components.
Delivering millimeter wave amplifiers enabling Gigabit speeds – at low cost.
Uses cloud Spot Instances and moves workloads to reduce costs by 80%.
Ultra low latency, high-performance AI Inference and advanced compute.
Continuing to work away on their big vision. Still a tech startup… still in stealth mode.
MRAMs replace SRAM and Flash as a smaller footprint and lower power alternative.
